The Benchtop TSV RDL Plating Machine is a compact electroplating system that integrates the functionalities of Through-Silicon Via filling and Redistribution Layer fabrication. Featuring a modular, desktop design, it is specifically optimized for R&D and low-volume production. Utilizing a precision electrochemical deposition system, this equipment can simultaneously perform two critical processes on wafers: filling conductive metal (primarily copper) into vertical TSV micro-holes to establish vertical interconnects between chips; and depositing fine RDL metal traces on the wafer surface to achieve signal redistribution and pad fan-out in the horizontal direction.

Application Fields

This equipment serves as a core tool for the development and pilot production of advanced packaging technologies.

• Core Application Fields:

• 2.5D/3D IC Packaging: Used for the integrated fabrication of TSVs and RDLs in interposers and wafer-level chip packaging.

• Fan-Out Packaging: Constructs high-density interconnect traces in fan-out packaging.

• CIS & MEMS Packaging: Provides 3D interconnect solutions for image sensors and micro-electro-mechanical systems.

• Typical Application Scenarios:

• New technology development and process validation in universities, research institutes, and corporate R&D centers.

• Pilot lines for low-volume, multi-variety advanced packaging of high-end chips (e.g., AI, HBM).

• Serves as pre-production validation and supplementation for fully automated production lines.

Its compact design and high process flexibility make it an ideal platform for exploring cutting-edge packaging architectures and accelerating product time-to-market.