The Benchtop TGV Plating Experimental System is a compact precision equipment specifically designed for Through-Glass Via technology research and sample prototyping. It features a desktop layout that integrates a plating bath, precision temperature control, and power supply system. Its core function is to achieve high-aspect-ratio metal filling (primarily copper) within micro-vias on glass wafers, forming vertical electrical interconnects.

Through optimized pulse or DC plating processes, combined with specialized additives and fluid dynamics design, the system addresses the challenge of achieving void-free, highly uniform metal filling within the vias on glass substrates. Its manual or semi-automatic operation modes provide process engineers with extensive flexibility for parameter debugging, making it an ideal experimental platform for TGV plating formula development, process exploration, and feasibility verification.

Application Fields

This equipment primarily serves the fields of advanced packaging and integration with specific requirements for glass substrates.

• Core Application Fields:

• RF Devices & Antennas: Used for RF filters, antenna-in-package in 5G/6G millimeter-wave communication systems, where the high resistivity of glass significantly reduces signal loss.

• MEMS & Sensors: Enables 3D integration of inertial sensors, pressure sensors, and microfluidic chips on glass substrates.

• Advanced Packaging & Integration: Serves as an alternative or supplement to silicon interposers for glass interposer interconnections in 2.5D/3D packaging.

• Typical Application Scenarios:

• Cutting-edge technology pre-research in universities, research institutes, and corporate R&D centers.

• Small-batch sample production and performance evaluation for specific products (e.g., high-performance RF modules).

This equipment serves as a fundamental building block for advancing glass-based 3D integration technology from the laboratory to industrialization.