Semi-automaticplating system
Semi-Automatic Wafer Plating Equipment
Semi-Automatic Wafer Plating Equipment

Integrated Circuit Manufacturing, Advanced Semiconductor Packaging, Micro-Electro-Mechanical Systems (MEMS), Compound Semiconductors, and Scientific Research

Semi-Automatic Wafer Plating Equipment

The semi-automatic wafer plating equipment is designed for precise deposition of metal thin films on wafer surfaces, serving as a critical tool for forming interconnection lines in chip manufacturing....

Semi-Automatic TSV Plating Equipment
Semi-Automatic TSV Plating Equipment

Advanced Packaging, Micro-Electro-Mechanical Systems (MEMS)

Semi-Automatic TSV Plating Equipment

The Semi-Automatic TSV Plating Equipment is a core process tool specifically designed for Through-Silicon Via technology development and small-to-medium volume production. It utilizes a precision elec...

TSV Plating Pre-Vacuum Treatment
TSV Plating Pre-Vacuum Treatment

Applications: 2.5D/3D IC Packaging, High-End Image Sensors (CIS), Micro-Electro-Mechanical Systems (MEMS)

TSV Plating Pre-Vacuum Treatment

The TSV Plating Pre-Vacuum Treatment Equipment is a specialized key tool in the field of 3D advanced packaging, designed to perform vacuum immersion treatment on wafers with deep holes prior to TSV pl...

Aluminum Housing Nickel-Gold Plating Equipment
Aluminum Housing Nickel-Gold Plating Equipment

Applications: Aerospace & Military Electronics, High-End Communication Equipment, Precision Medical Devices

Aluminum Housing Nickel-Gold Plating Equipment

The Aluminum Housing Nickel-Gold Plating Equipment is a complete system specifically designed for functional electroplating on aluminum alloy housing surfaces. Its core process addresses the challenge...