The TSV Plating Pre-Vacuum Treatment Equipment is a specialized key tool in the field of 3D advanced packaging, designed to perform vacuum immersion treatment on wafers with deep holes prior to TSV plating deposition. Its core purpose is to thoroughly remove residual gases and bubbles from the micron-scale deep TSV holes.

By fully immersing the wafer in a specialized chemical solution and evacuating the chamber to a high vacuum level, the equipment forces gases within the deep holes to escape and be replaced by the plating solution. This step is crucial as it fundamentally prevents critical defects such as "voids" and "gaps" caused by trapped bubbles during subsequent plating processes. It serves as a prerequisite for achieving void-free, highly uniform, and reliable metal filling in TSVs.

Application Fields

This equipment is essential for all fields requiring high-quality TSV processes:

• Core Applications:

• 2.5D/3D IC Packaging: Such as High Bandwidth Memory (HBM) and heterogeneous chip integration (e.g., CoWoS, SoIC).

• High-End Image Sensors (CIS): Particularly for TSV interconnects in backside-illuminated CIS.

• Micro-Electro-Mechanical Systems (MEMS): Ensures defect-free metallization for deep trench structures in MEMS devices.

• Scenarios:

• Mass production lines with stringent requirements for TSV plating yield and reliability.

• R&D and pilot lines focused on cutting-edge 3D integration technologies.

Although this equipment does not perform the plating process directly, its precise vacuum displacement capability makes it a critical enabler for improving the overall success rate of TSV processes and enhancing product performance.