The Horizontal Copper Etching Machine is a specialized wet process equipment that utilizes a horizontal conveyor system to remove unwanted copper from substrate surfaces, forming precise circuit patterns. It employs a continuous horizontal transport mechanism where panels pass sequentially through multiple process chambers including etching, rinsing, and drying sections.

The equipment features precision spray etching with chemical solutions (such as acidic cupric chloride or alkaline ammonia) to dissolve exposed copper, followed by multi-stage high-pressure rinsing to remove residues and stop the etching reaction, concluding with efficient air knife drying. This horizontal configuration ensures uniform etching rates, excellent line width control, and minimal undercut, making it essential for producing high-density interconnects with critical dimension accuracy.

Application Fields

This equipment is fundamental for circuit formation in various electronic manufacturing sectors.

• Core Application Fields:

• Integrated Circuit Manufacturing: Forms interconnect wiring and through-silicon vias in semiconductor devices.

• Packaging Substrates & HDI PCB: Creates fine-line circuits in IC substrates and high-density interconnect printed circuit boards.

• Flat Panel Display: Patterns electrode circuits and thin-film transistor arrays in display panels.

• Extended Applications:

• Advanced Packaging: For RDL (redistribution layer) formation in fan-out wafer-level packaging.

• MEMS Devices: Creates copper microstructures in micro-electromechanical systems.

• High-Frequency Circuits: For precision etching in RF and microwave circuit boards.

The machine's etching precision and uniformity directly determine the electrical performance and reliability of the final circuits, making it a crucial component in electronic device manufacturing.