The Rotary Copper-Titanium Etching Machine is an advanced wet processing system specifically designed for precision etching of both copper and titanium materials. It features a unique rotating drum mechanism that ensures uniform exposure to etching solutions across all workpiece surfaces.

The equipment employs multi-chamber rotary processing with specialized chemical formulations for each metal type - acidic solutions for copper etching and fluoride-based solutions for titanium. The rotating action provides consistent agitation, enabling high-precision pattern transfer with excellent etch rate control and minimal undercut. This configuration is particularly effective for complex geometries and high-aspect-ratio structures.

Application Fields

This versatile etching system serves multiple high-tech industries requiring precision metal patterning.

• Core Application Fields:

• Advanced Semiconductor Packaging: For RDL formation, TSV patterning, and interconnect fabrication in 2.5D/3D packaging.

• MEMS Device Fabrication: Creates precise microstructures in both copper conductors and titanium structural layers.

• Medical Implants & Precision Instruments: Patterns titanium biomedical implants and copper components for surgical tools.

• Extended Applications:

• Aerospace Components: For etching copper heat exchangers and titanium structural parts.

• Advanced Interposers: Patterns fine-pitch copper circuits on titanium-based substrates.

• Sensor Manufacturing: Creates precision electrodes and sensing elements in multi-material systems.

The machine's ability to handle multiple materials with high precision makes it indispensable for advanced manufacturing applications requiring complex multi-metal patterning.